Fab.nano is the shared fabrication facility at MIT where users carry out controlled processing of micro- and nanoscale structures. Our advanced cleanroom facilities offer capabilities ranging from lithography, etching, and deposition to diffusion, wet processing, and packaging.
Fab.nano offers numerous tools for use by any researcher trained to use our facilities. Some individuals may come to build an entire device, while others may need to use the fab for only one portion of their project. Researchers from many different departments can work side by side, sharing the equipment and learning from each other’s processes.
Your guide for navigating the equipment and spaces is the Fab.nano user interface. This web-based platform details the full set of toolsets across different process categories (e.g, deposition, etching, lithography); as well as specifies a tool's equipment, technical staff, base cost, and other information.
- In Building 12 (map), the fab comprises nearly 50,000 square feet of Class 100/1,000/10,000 cleanroom, occupying the first and third floors of MIT.nano. There are also packaging and other capabilities in the fifth-floor prototyping space.
- Building 24 (map) is home to one of the tools in our electron-beam lithography (EBL) facility.
MIT Lincoln Lab Microelectronics Laboratory
MIT Lincoln Laboratory’s Microelectronics Laboratory (ML) is a 200 mm wafer processing facility, equipped with commercial-class cassette-to-cassette fabrication equipment and professionally staffed 24 hours a day, five days a week. This 90 nm-class facility operates full-flow fabrication across a broad range of integrated circuit technologies, including FD-SOI CMOS, CCD imagers, superconducting electronics, photonics, MEMs, and microfluidics.
MIT.nano collaborates with Lincoln Laboratory to offer the ML's prototyping services to companies. Read more about this facility.