Past Events

Enabling atomic resolution Cryogenic Electron Microscopy

Presented by Jeff Lengyel, Principal Scientist

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This presentation will discuss recent technological advancements in various aspects of Cryo-EM. These recent developments will not only enhance throughput, but also the resolution achieved with single particle analysis and cryo-electron tomography.

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Integrated photonics and electronics for chip-scale quantum control of trapped ions

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Jules Stuart, Research Assistant
MIT Lincoln Laboratory
Physics PhD candidate, 2021

Trapped atomic ions are promising candidates for quantum information processing and quantum sensing. Current state-of-the-art trapped-ion systems require many lasers and electronics to achieve precise timing and control over quantum states.  Usually, electronic signals are sent into vacuum chambers via wire feedthroughs, and laser light is focused down to a trapped ion’s location with external lenses mounted outside of viewports on the chamber. These requirements lead to dense and complex setups that may be prone to drift and limit the amount of control that can be achieved.

In this presentation, Stuart will report on recent progress toward integrating control technology into the substrate of the ion trap itself. By using a planar trap design, which is compatible with lithographic fabrication, other well-developed processes may be implemented in order to enhance the function of the ion trap. In one experiment, researchers demonstrate an ion trap with integrated, CMOS-based high-voltage sources, which can be used to control the motional frequency and position of a trapped ion. In another demonstration, they use photonic waveguides and diffractive grating couplers to route light around a chip and focus it onto ions trapped above the surface.

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Tuesday, February 16, 2021
11 a.m. – 11:45 a.m. EST

James McRae, Graduate student
Mechanical Engineering (MechE)
MIT Lincoln Laboratory, Advanced Materials & Microsystems

Electronic microsystems are foundational to today’s computational, sensing, communication, and information processing capabilities, therefore impacting industries such as microelectronics, aerospace, healthcare, and many more. Cell phones are an example of what is possible when a variety of systems can be tightly integrated into a highly portable and capable system. However, as we aim to improve our ability to interact and operate (e.g., sense, communicate, record, compute, move, etc.) in extreme environments (such as outer space or the human body), new methods and materials must be developed to manufacture such integrated systems that will endure post-processing, environmental, and operational challenges.

Typical organic-based packaging materials (e.g., polymer adhesives, coatings, and molding materials) often suffer from outgassing and leaching that can lead to system contamination, as well as coefficient of thermal expansion (CTE) mismatches that can lead to warpage and breakage with fluctuations in system temperature during operation. This work demonstrates an alternative, by using a silicate-based inorganic glass composite as an electronics packaging material for stability in extreme environments. Combining liquid alkali sodium silicate (water glass) and nanoparticle fillers, composites can be synthesized and cured at low temperatures into chemically, mechanically, and thermally (up to 400 oC) stable structures using high throughput processing methods such as spin and spray coating. Further, this material can be processed into thick layers (10s to 100s of microns), fill high aspect ratio gaps (13:1), withstand common microfabrication processes, and have its CTE tailored to match various substrates.

Attendees can join and participate in the series via Zoom. Meeting ID#: 860 986 455.

>>See the upcoming schedule and watch past talks.